Monday, October 6, 2008

Interview Qs for physical design engineer

These r some interview question can be thrown on physical design engineer.
when u r prepar ing for a interview think if u are the rickcuter then what type of question u want to ask for that job ..................



In which field are you interested?Answer to this question depends on your interest, expertise and to the requirement for which you have been interviewed.
This will be the first question and important one also
no of projects u worked on?
answer depends upon ur experience but if u work on full project cycle ,it will be plus point reather then many project but not full cycle
what are the factor a layout engineer should take care during work ?
1.placement of the block should be according to the methology defined for the layout .
2. optimize routing .
3.take care for the ECOs.
4. timing and resistance of the signals.
5.symmetrical and hierarchical .easy to change .

Do you know about input vector controlled method of leakage reduction?
Leakage current of a gate is dependant on its inputs also. Hence find the set of inputs which gives least leakage. By applyig this minimum leakage vector to a circuit it is possible to decrease the leakage current of the circuit when it is in the standby mode. This method is known as input vector controlled method of leakage reduction.

How can you reduce dynamic power?-Reduce switching activity by designing good RTL
-Clock gating
-Architectural improvements
-Reduce supply voltage
-Use multiple voltage domains-Multi vdd

What are the vectors of dynamic power?
Voltage and Current
If you have both IR drop and congestion how will you fix it?
-Spread macros
-Spread standard cells
-Increase strap width
-Increase number of straps
-Use proper blockage
Is increasing power line width and providing more number of straps are the only solution to IR drop?
-Spread macros
-Spread standard cells
-Use proper blockage
In a reg to reg path if you have setup problem where will you insert buffer-near to launching flop or capture flop? Why?
(buffers are inserted for fixing fanout voilations and hence they reduce setup voilation; otherwise we try to fix setup voilation with the sizing of cells; now just assume that you must insert buffer !)
Near to capture path.
Because there may be other paths passing through or originating from the flop nearer to lauch flop. Hence buffer insertion may affect other paths also. It may improve all those paths or degarde. If all those paths have voilation then you may insert buffer nearer to launch flop provided it improves slack.
What is the most challenging task you handled? What is the most challenging job in P&R flow?-It may be power planning- because you found more IR drop
-It may be low power target-because you had more dynamic and leakage power
-It may be macro placement-because it had more connection with standard cells or macros
-It may be CTS-because you needed to handle multiple clocks and clock domain crossings
-It may be timing-because sizing cells in ECO flow is not meeting timing
-It may be library preparation-because you found some inconsistancy in libraries.
-It may be DRC-because you faced thousands of voilations
How will you synthesize clock tree?-Single clock-normal synthesis and optimization
-Multiple clocks-Synthesis each clock seperately
-Multiple clocks with domain crossing-Synthesis each clock seperately and balance the skew
How many clocks were there in this project?
-It is specific to your project
-More the clocks more challenging !
How did you handle all those clocks?-Multiple clocks-->synthesize seperately-->balance the skew-->optimize the clock tree
Are they come from seperate external resources or PLL?-If it is from seperate clock sources (i.e.asynchronous; from different pads or pins) then balancing skew between these clock sources becomes challenging.
-If it is from PLL (i.e.synchronous) then skew balancing is comparatively easy.
Why buffers are used in clock tree?
To balance skew (i.e. flop to flop delay)
What is cross talk?Switching of the signal in one net can interfere neigbouring net due to cross coupling capacitance.This affect is known as cros talk. Cross talk may lead setup or hold voilation.
How can you avoid cross talk?
-Double spacing=>more spacing=>less capacitance=>less cross talk
-Multiple vias=>less resistance=>less RC delay
-Shielding=> constant cross coupling capacitance =>known value of crosstalk
-Buffer insertion=>boost the victim strength
How shielding avoids crosstalk problem? What exactly happens there?-High frequency noise (or glitch)is coupled to VSS (or VDD) since shilded layers are connected to either VDD or VSS.
Coupling capacitance remains constant with VDD or VSS.
How spacing helps in reducing crosstalk noise?width is more=>more spacing between two conductors=>cross coupling capacitance is less=>less cross talk

Why double spacing and multiple vias are used related to clock?Why clock?—because one thing this is the life line of the circuit .
And second it is the one signal which changes it state regularly and more compared to any other signal. If any other signal switches fast then also we can use double space.
Double spacing=>width is more=>capacitance is less=>less cross talk
C=(- A / d
Multiple vias=>resistance in parellel=>less resistance=>less RC delay
How buffer can be used in victim to avoid crosstalk?Buffer increase victims signal strength; buffers break the net length=>victims are more tolerant to coupled signal from aggressor.
Shielding of the victim
Decrease the width of the signal

INSTITUTE FOR VLSI IN INDIA

I have seen that many fresh engineers in India want to enter the VLSI field and are actively looking for good training institutes within India.


if u want to do master degree then here are some institute ,but for these good GATE score(more then 98 percentile) is required,These all college gives M.Tech ,M.S. Degree , only some gives PG Diploma in vlsi.
1)IISc Bangalore - This is the best institute in india for VLSI .


2) IIT Bombay -has a PG course in microelectronics the basic qualification are a valid gate score in required discipline.


3)IIT Chennai -The department of Electrical engineering conducts a course in Microprocessors,Digital Systems and Analogue Systems ,VLSI Design


4) IIT Delhi (VLSI Design Tools and Technology) -conducts an interdisciplinary M. Tech program the participating departments are Dept. of Computer Science and Engg, Dept. of Electrical Engg, Centre for Applied Research in Electronics


5)IIT Kharagpur Dept of Electronics & Electrical Communication Engineering -Conducts a post gradate course in VLSI


6)IIT Guwahati Department of Electronics & Communication Engineering This departments lists work in VLSI, Digital Design, Mixed Signal processing etc.





other then these there is some REC and private institute are
1.(North) Thapar Institute of Engineering and Technology (TIET), Patiala.


2.(North) BHU-Institute of Technology (BHU-IT), Varanasi.


3.(East) Bengal Engineering College (BEC), Howrah.


4.(East) Jadhavpur University, Jadhavpur.


5.(East) REC, Rourkela.


6.(South) REC, Warangal.


7.(South) PSG College of Engineering, Coimbatore.


8.(South) KREC, Suratkal.


9.(West) VRCE, Nagpur.


10.(West) GSITS, Indore.


11 .(West) Malaviya REC, Jaipur.


12.BITS Pilani Offers M.E. in Microelectronics .


13.Manipal centre for Information Science offers a MS VLSI CAD in tie up with Synopsys Inc.


14.M-Tech Course in microelectronics is conducted at Panjab University,Chandigarh in collaboration with Semiconductor Complex Ltd,Mohali and CSIO Chd.





Some other institutes(Private /Govt) offering a short term course in VLSI domain are >





* CDAC Advanced Computing Training School offers a diploma in VLSI. i think CDAC(pune center only) the best institute for short term course in india.


*University of Pune. (PG Course). -- also very good for the PG Diploma Course.


* Sandeepani-School of VLSI Design a division of CG-Coreel Programmable Solutions offers PG-Diploma in VLSI Design, Corporate training, Workshop and Seminars and onsite customised trainings . but now a days sandeepani giving only frant end(VHDL,Verilog,fpga ) course. this institute is also good .
* Horizon has a course in VLSI,VHDL,Verilog only.

*RV VLSI is a very god institute in Bangalore . It offers VLSI Front-end design, VLSI Back-end or Physical Design, FPGA design methodologies, Full custom design methodologies and embedded systems course.
http://www.rv-vlsi.com/

*V3Logic offer "Diploma in VLSI Design" - Five month full time course at Banagalore and Pune .

http://www.v3logic.com/


*VEDA IIT(VLSI Engineering and Design Automation Institute of Information Technology)7-144/1, New Nagendra agar Colony,Habsiguda,Hyderabad - 500007.Phone: 7158089, 7176040. this institute is not related ot any of the IIT's


* Accel Technologies: offers a course, duration 4 months leading to a degree of 'Post Graduate Diploma in VLSI Design' at Chennai


* Blue Logics offers a 2 months vlsi design course.


BlueLogics Software(India) Pvt. Ltd., #44, 4th Floor "Shalin", Anandnagar post office, Mahalaxmi-Bhatha Road, Ahmedabad - 380007 Ph: 91-79-6636279 91-79-6641708 email:mailto:gujarat@bluelogics.comWWW: http://www.bluelogics.com/


* Trident Techlabs Pvt Ltd. offers a two courses in VLSI Design of duration 20 & 8 weeks respectively.


Trident Techlabs Pvt. Ltd. -- 169, 3rd Floor, -- Raja Garden, -- New Delhi-110 015 -- India -- Tel. : 91 -11- 591 7645, 591 7832 -- Fax : 91- 11- 593 9960


* http://www.tridenttechlabs.com/contactus.htm


* Benns Technologies Offers a 4 months Part time/Full Time course in VLSI at Bangalore


* Calorex Institute of Technology offers a VLSI ASIC CHIP DESIGN COURSE of 18 week duration.


* Vedant (launched by Semiconductor Complex Ltd an enterprise of Ministry of Information technology, govt. of India) offers a six month full time course and covers both front end and back end design including Analog & Mixed Signal design. The admission is through an entrance test


*VEDA IIT, -- D.NO. 7 -148/3 -- NEW NAGENDRA NAGAR COLONY, -- HABSIGUDA -- HYDERABAD -7 -- http://www.stph.net/vedaiit/


*TTM at Hyderabad, Bangalore offers IC Design courses specialized in BACKEND but fee is very high (90 thousand for backend )


TTM (INDIA) PVT, LTD. -- B-1/2, Chandralok Cplx, -- 111, S.D. Rd, -- Secunderabad - 3 -- Ph: 040-7844198 -- Email ::mailto:mmpraju@hd1.vsnl.net.in














Sunday, September 28, 2008

Flow for IC desinging.............

Before starting any project engineers collects the all functionality , working criteria (fr. ,power estimation ) that is called system specifications. This is a very important part of any project ,if all the specifications are clearly defined and documented then project will go on write path.




This is the basic flow for designing the integration circuit. That is mainly divide in to 2 parts .
*Front -end -> This is the portion where designer write codes for creating the circuit that can work as functionality. front end also devided in many parts for designing......



1> FUNCTIONAL DESIGNING--- in this portion engineers start coding for the desire circuit.


in this phase coding is done according to the functionality only. For coding many language are used as c , system c , vhdl , verilog.



2> LOGIC DESINGING--- In this portion engineers start to make the code competible to the circuit designs.


* Back -end ->




as shown in the above picture backend part also contain main devision and a very important part of the IC.




*First step to take netlist from the frontend part .netlist contain all the information of the design in circuit form(gate lavel means every design is converted in mux,flop,gates,thransistor).
after that design engineer have to optimize it according to the timing , power .





*Then layout team have to make a plan for the floorplanning on chip.during the floorplanning design considers some points as ->

a) pin and bumps locations.

b) aspect ratio.

c) congestion due to the placement of the logic blocks.

d) Timing constrains.



* Next work is to make the partition of the logic on the floor ,that is required for make the easy layout . in this partitioning flat design is converted in to the hereriary design and clock , power group.

* power planning is a important part of the chip designing . in this engineers make a plan for power signal . power is given by top most layers of the metels used in the chip implementation , because this have many advantages as --> low resistance , less congestion in routing , less power heating. for upper level of routing . power signals are distributed by using macro ring,trunks.


*For placement cell are placed according to the timing required, pin location and optimized routing . setup timing is taken care during placement of cells .



* CTS (clock tree synthesis)-- is very important part of the chip designing . CTS gives the information about the skew , setup and hold time violation . for optimization many techniques are used as increase buffer size, insert buffers, put flip flop in combinational logic. after CTS mainly hold time violation is resolved.




* Routing is done according to the routing algo. as HVH,VHV,centriod . In routing many metal layer used . upper metal have less resistance and large width then the lower metals .top level metal layers are used for power and clock distribution.


*DFM(design for manufacturing)--in this phase many filler.dummy cell are put due to make the smooth surface of the each metal layer . this work is done by the DFM tool at each metal layer level. now a days DFM is very important part of IC designing.



finally got the GDS II for making the mask for implementing the chip.

















Types of ICs

These are the types of the IC(intergated circuit). but ASIC (application specifice integrated circuit) is the main IC which is used now a days. asic is implemented according to the application .This ASIC is many have 3 types as
1> programmable ic - that is the ic which is implemented in a particular pattern. it can be programmed before or after the implementation depands upon the type of ic. This types of ic is mainly used in memory .
2>semi custom ic -this is mixed type of the ASIC and programmable IC . now a days this is comes under custom ASIC.
3>custom ic - custom ic are used now a days. 70% of the IC are ASIC now a days. In ASIC ,standard cell and custom both styles are used but standard cell ic are used because that have easy layouting and decrease time to market.