Saturday, March 27, 2010

SRAM

SRAM

 

Static Random Access Memory [SRAM]


Static Random Access Memory retains information placed within its cells until the values are overwritten or the power is switched off. Since SRAM doesn’t need to be refreshed constantly, reading and writing to memory can occur continuously. This allows it to be much faster than DRAM, which needs to pause between memory accesses to refresh and ensure that its contents are retained. Cache is much faster than main memory because it is implemented using SRAM














                                                                  Memory hierarchy







 



Basic six transistor SRAM memory cell






Pmos left side is M1 ,Nmos connected to bit line is M2,Nmos left side down is M3.


Pmos right side is M4 ,Nmos connected to bit line # is M5,Nmos right side down is M6.

(A) WRITE OPERATION:


When want to write 1 then bit line 1 and bit line# 0 will be apply . For this there may be 2 cases .


1) If node A having 1 and node b having 0 then


There will be very less current pass though M5 ( word line be on first) and node b will get discharge fully and create strong 0 . it will be depends upon the size of the m6 and m5 .


There will be very less current pass though M2 ( word line be on first ) and node a will be recharge again to strong 1 .


2) If node a having 0 and node b having 1 then


(B) READ OPERATION: for read operation both bit line and bit line # will be precharge to 1, then


1) if node a having 1 and node b having 0 then voltage of the bit line # will decrease this much the it will be less then weaker 1 (because of the M5 resistance it will not be fully discharge ) ,then difference between the bit line and bit line # is measured by the sense amplifier . Sense amplifier should be capable to measure this voltage difference. Timing of prechanging and sense amplifier should be different so there should not be short path between precharge and sense amplifier .




SIZING OF SRAM: sizing depends upon the technology used and the timing of the circuit required. Normally the sizes of the transistors are like M3 >M2 >M1.




Bit Line Precharge: used to precharge the bit line and bit line # before the read and write circuit . for this 3 pmos are used and connected at the same point so this circuit can provide strong 1 (pmos passes stronger 1 ).


Column Decoder Mux: use segmented mux to decode the address to the word lines .


Done many stage if address is big . domino logic can be used for fast speed.



Write driver circuitry : used to write the reuired bit on the memory node .


Sense Amplifier: important block for the reading operation . differential amplifier is used . sense amplifier amplified the low voltage difference between bit line and bit line #.


So reading speed is depends upon the sense amp.

Logic Optimization Techniques


There are many phase during the VLSI Flow. During these phase some logic optimization techniques are used .These increase performance, speed and decrease power. Some of those are:

Optimization technique during the coding:


• Used of unsigned integer (if u know value will not go to be negative) because it take less memory location and faster execution.


• Don’t use the nested if else loop. It will increase the complexity of the circuit and will put the many mux after synthesis those are not good for the design.


• Don’t use the global variable in critical loops.


• Use of switch circuit help in optimization of the circuit.


• Use of blocking statement helps in the reduce the race conditions.


• Logic should be more sequentional. Clock control circuit.


• Cloning of the logic is helpful.


• Always pass a structure by reference never pass it as a parameter.


• Use recursive should be avoided.


• Use single dimensional array avoid multidimensional array.






Optimization technique during the sch design :


• Use of many low fan-out/in gates in place of the single high fan-out/in gate.


• Use of domino logic where more speed path required.


• Put the signal (which is coming late) near to the output .so critical path will be less.


• Divide the load if it is more. One single wire into two signals.


• Put the lower transistor size in n logic higher the upper because it is driving full load.


• Use the multi Vt cell for lower leakage.


• Use the pass gates for fast circuit but be careful for the leakage and other things so always put the invertors after the pass gate.










Optimization technique during the layout:


• Put more no of the tap so latch up will be less.


• Use the strapping for big drivers.


• Use the shielding for the more activated signal.


• Use the more decap cell near the sensitive circuit.


• Use of symmetisity in routing.


• For long routing use the higher metal layers.


• For the clock shielding put one side vcc and second side vss.


• Clock routing should be in upper metal layers.


these techniques are very use full for a good design .

DESIGN FOR SPEED

Hi,  this post is for the designing of high speed digital design . some concepts of fast current in wires and how to control that fast current for fast processing .
        CMOS technology is used in  the ic. because of many reasons like - less area , easy to fabriacate , low power consumption , fast speed , balanced circuits .



       there are many techniques for speed up  in design in data path and clock paths.
some are -
  • put the buffer in critical path . buffer insertion will give many effect in path . it will increase the speed , change the slope of transation of voltage , will give the full swing , decrease the cross cap . 
  •   inside the gate put the input (which have the probability of coming late ) near to output .so critical path will be less .
  • put domino logic .
  • increase the supply voltage where ever is high speed require . for this multivoltage cell are used .
  • put the transistor near to the output that have probability of input coming late .
  • no of level in a path should be according to the logical effort .
there are many more .............

Tuesday, December 15, 2009

Low Power Techniques

Why low power is required in circuit ?
Answer so don't need this -->



• Packaging costs

• battery Size increase with the power .

• Power supply rail design .

• Chip and system cooling costs .

• Noise immunity and system reliability

• Battery life (in portable systems) .

• Environmental concerns .



Lets take a look at various low power techniques in use today

(a)Traditional Techniques

• Clock gating (designed carefully due to clock feedback , glitch sensitive )

• Power gating (more area used for sleep circuit but very useful technique )

• Variable frequency (multi fr. PLL is required and handling is tough job )

• Variable voltage supply (extra power regulator circuit is used )

• Variable device threshold

• Minimize capacitance by custom design


(b) architecture Techniques

• Use of sleep mode .

• Make partion of the circuit (like memory spilt in many blocks )

• Power efficient circuits

• Parallelism in micro-architecture



Which one of the above techniques are aimed at reducing Dynamic Power and Leakage Power

Dynamic Power Reduction

• Clock Gating

• Power efficient circuits

• Variable frequency

• Variable voltage supply

Leakage Power Reduction

• Minimize usage of Low Vt Cells

• Power Gating

• Back Biasing

• Reducing Dynamic Power

• Reduce Oxide Thickness

• Use FINFET’s


Sunday, May 10, 2009

LIFECYCLE OF CHIP

I want to design a chip –
today I m thinking we are working in vlsi industry that cool but how mach we know about the full chip starting to end this article I m writing as par my knowledge .if u want to add some thing u are most welcome because this will help me also in my learning process . I m writing this blog to give info about vlsi (what ever I know ) but with that this is my learning ladder also . so feel free to
Give any suggestion or adding some thing …………..

If I want to design a chip for that I looks the things like
· What will be the functionality of the chip. What are the main functionality and what are the I can try for with main functionality ?

first will be why I m designing this (specification and advantage )


· What are the io interfaces I will use for interface?
· In how many Different functional unit will be better to have in design means how much flexibility will be in design?
· Which language will be better for writing the code . what are the diff. portion .is there any analog part also .is there any previous code that I can use in my design ?
· What will be the clock speed and power consumption ?
· How many type of clock will required ?
· What will be the die size?
· What are the tool required for this type of the design ?

These are some question which should be take care.

So finally be confidante I have decided to write the code . for that first I want to test the specification will it is possible for me to create a code that gives the required functionality ?
or to check how much difficult to write that thing ? I will be able to write this type of code !!!!!!

for that test I would like to write my code in functional oriented language like c if I m able to write a functional code then I will verified it by test bench .
if it works then will convert it to the HDL (hardware description language ) like VHDL ,Verilog
it depends upon the particular comfort but I like verilog because it is easier to learn and coding for fresher.
in VHDL we have little more control on circuit as I think .
then synthesis the code means convert the code in to the circuit . covert the logic in to the circuit by netlisting it and verified
is it my real circuit using FEV (formal equivalent verification )


the simulate it with the test benches .if that is verified
then come to the backend and with that pre si validation test also .
here we will start to check many things like – timing ,power consumption ,placement and floor planning of the circuit, means overall we can say that will this design work on silicon or not (are we working on the implementable circuit ) .

according to the requirement we changes the circuit that is called ECO (engineering order changes )
we will put some extra circuit in our design that will be used when u want to dig up the cause of bags after implementation on silicon like scan circuit and fib cells .

now come to layout that is the physical implementation of the circuit on the silicon . floor planning is the crucial step of that . in ASIC people used the standard cell for the implementation of layout that have more flexibility and precession then any pld cell or custom cell usages.
There is two part of the validation in design flow : one is pre si validation , second is the post si validation .
After completion of the circuit layout DFM is implemented for reliability and density .
During the layout many checks are there like DRC (design rule check , dependes upon the technology used ), RV (reliability verification ), DFM density check , antenna checks etc .

After completion of layout that is sent to the fabrication unit and mask is created according to the technology files .

this article give some over view of the vlsi flow……………………….

Monday, October 6, 2008

Interview Qs for physical design engineer

These r some interview question can be thrown on physical design engineer.
when u r prepar ing for a interview think if u are the rickcuter then what type of question u want to ask for that job ..................



In which field are you interested?Answer to this question depends on your interest, expertise and to the requirement for which you have been interviewed.
This will be the first question and important one also
no of projects u worked on?
answer depends upon ur experience but if u work on full project cycle ,it will be plus point reather then many project but not full cycle
what are the factor a layout engineer should take care during work ?
1.placement of the block should be according to the methology defined for the layout .
2. optimize routing .
3.take care for the ECOs.
4. timing and resistance of the signals.
5.symmetrical and hierarchical .easy to change .

Do you know about input vector controlled method of leakage reduction?
Leakage current of a gate is dependant on its inputs also. Hence find the set of inputs which gives least leakage. By applyig this minimum leakage vector to a circuit it is possible to decrease the leakage current of the circuit when it is in the standby mode. This method is known as input vector controlled method of leakage reduction.

How can you reduce dynamic power?-Reduce switching activity by designing good RTL
-Clock gating
-Architectural improvements
-Reduce supply voltage
-Use multiple voltage domains-Multi vdd

What are the vectors of dynamic power?
Voltage and Current
If you have both IR drop and congestion how will you fix it?
-Spread macros
-Spread standard cells
-Increase strap width
-Increase number of straps
-Use proper blockage
Is increasing power line width and providing more number of straps are the only solution to IR drop?
-Spread macros
-Spread standard cells
-Use proper blockage
In a reg to reg path if you have setup problem where will you insert buffer-near to launching flop or capture flop? Why?
(buffers are inserted for fixing fanout voilations and hence they reduce setup voilation; otherwise we try to fix setup voilation with the sizing of cells; now just assume that you must insert buffer !)
Near to capture path.
Because there may be other paths passing through or originating from the flop nearer to lauch flop. Hence buffer insertion may affect other paths also. It may improve all those paths or degarde. If all those paths have voilation then you may insert buffer nearer to launch flop provided it improves slack.
What is the most challenging task you handled? What is the most challenging job in P&R flow?-It may be power planning- because you found more IR drop
-It may be low power target-because you had more dynamic and leakage power
-It may be macro placement-because it had more connection with standard cells or macros
-It may be CTS-because you needed to handle multiple clocks and clock domain crossings
-It may be timing-because sizing cells in ECO flow is not meeting timing
-It may be library preparation-because you found some inconsistancy in libraries.
-It may be DRC-because you faced thousands of voilations
How will you synthesize clock tree?-Single clock-normal synthesis and optimization
-Multiple clocks-Synthesis each clock seperately
-Multiple clocks with domain crossing-Synthesis each clock seperately and balance the skew
How many clocks were there in this project?
-It is specific to your project
-More the clocks more challenging !
How did you handle all those clocks?-Multiple clocks-->synthesize seperately-->balance the skew-->optimize the clock tree
Are they come from seperate external resources or PLL?-If it is from seperate clock sources (i.e.asynchronous; from different pads or pins) then balancing skew between these clock sources becomes challenging.
-If it is from PLL (i.e.synchronous) then skew balancing is comparatively easy.
Why buffers are used in clock tree?
To balance skew (i.e. flop to flop delay)
What is cross talk?Switching of the signal in one net can interfere neigbouring net due to cross coupling capacitance.This affect is known as cros talk. Cross talk may lead setup or hold voilation.
How can you avoid cross talk?
-Double spacing=>more spacing=>less capacitance=>less cross talk
-Multiple vias=>less resistance=>less RC delay
-Shielding=> constant cross coupling capacitance =>known value of crosstalk
-Buffer insertion=>boost the victim strength
How shielding avoids crosstalk problem? What exactly happens there?-High frequency noise (or glitch)is coupled to VSS (or VDD) since shilded layers are connected to either VDD or VSS.
Coupling capacitance remains constant with VDD or VSS.
How spacing helps in reducing crosstalk noise?width is more=>more spacing between two conductors=>cross coupling capacitance is less=>less cross talk

Why double spacing and multiple vias are used related to clock?Why clock?—because one thing this is the life line of the circuit .
And second it is the one signal which changes it state regularly and more compared to any other signal. If any other signal switches fast then also we can use double space.
Double spacing=>width is more=>capacitance is less=>less cross talk
C=(- A / d
Multiple vias=>resistance in parellel=>less resistance=>less RC delay
How buffer can be used in victim to avoid crosstalk?Buffer increase victims signal strength; buffers break the net length=>victims are more tolerant to coupled signal from aggressor.
Shielding of the victim
Decrease the width of the signal

INSTITUTE FOR VLSI IN INDIA

I have seen that many fresh engineers in India want to enter the VLSI field and are actively looking for good training institutes within India.


if u want to do master degree then here are some institute ,but for these good GATE score(more then 98 percentile) is required,These all college gives M.Tech ,M.S. Degree , only some gives PG Diploma in vlsi.
1)IISc Bangalore - This is the best institute in india for VLSI .


2) IIT Bombay -has a PG course in microelectronics the basic qualification are a valid gate score in required discipline.


3)IIT Chennai -The department of Electrical engineering conducts a course in Microprocessors,Digital Systems and Analogue Systems ,VLSI Design


4) IIT Delhi (VLSI Design Tools and Technology) -conducts an interdisciplinary M. Tech program the participating departments are Dept. of Computer Science and Engg, Dept. of Electrical Engg, Centre for Applied Research in Electronics


5)IIT Kharagpur Dept of Electronics & Electrical Communication Engineering -Conducts a post gradate course in VLSI


6)IIT Guwahati Department of Electronics & Communication Engineering This departments lists work in VLSI, Digital Design, Mixed Signal processing etc.





other then these there is some REC and private institute are
1.(North) Thapar Institute of Engineering and Technology (TIET), Patiala.


2.(North) BHU-Institute of Technology (BHU-IT), Varanasi.


3.(East) Bengal Engineering College (BEC), Howrah.


4.(East) Jadhavpur University, Jadhavpur.


5.(East) REC, Rourkela.


6.(South) REC, Warangal.


7.(South) PSG College of Engineering, Coimbatore.


8.(South) KREC, Suratkal.


9.(West) VRCE, Nagpur.


10.(West) GSITS, Indore.


11 .(West) Malaviya REC, Jaipur.


12.BITS Pilani Offers M.E. in Microelectronics .


13.Manipal centre for Information Science offers a MS VLSI CAD in tie up with Synopsys Inc.


14.M-Tech Course in microelectronics is conducted at Panjab University,Chandigarh in collaboration with Semiconductor Complex Ltd,Mohali and CSIO Chd.





Some other institutes(Private /Govt) offering a short term course in VLSI domain are >





* CDAC Advanced Computing Training School offers a diploma in VLSI. i think CDAC(pune center only) the best institute for short term course in india.


*University of Pune. (PG Course). -- also very good for the PG Diploma Course.


* Sandeepani-School of VLSI Design a division of CG-Coreel Programmable Solutions offers PG-Diploma in VLSI Design, Corporate training, Workshop and Seminars and onsite customised trainings . but now a days sandeepani giving only frant end(VHDL,Verilog,fpga ) course. this institute is also good .
* Horizon has a course in VLSI,VHDL,Verilog only.

*RV VLSI is a very god institute in Bangalore . It offers VLSI Front-end design, VLSI Back-end or Physical Design, FPGA design methodologies, Full custom design methodologies and embedded systems course.
http://www.rv-vlsi.com/

*V3Logic offer "Diploma in VLSI Design" - Five month full time course at Banagalore and Pune .

http://www.v3logic.com/


*VEDA IIT(VLSI Engineering and Design Automation Institute of Information Technology)7-144/1, New Nagendra agar Colony,Habsiguda,Hyderabad - 500007.Phone: 7158089, 7176040. this institute is not related ot any of the IIT's


* Accel Technologies: offers a course, duration 4 months leading to a degree of 'Post Graduate Diploma in VLSI Design' at Chennai


* Blue Logics offers a 2 months vlsi design course.


BlueLogics Software(India) Pvt. Ltd., #44, 4th Floor "Shalin", Anandnagar post office, Mahalaxmi-Bhatha Road, Ahmedabad - 380007 Ph: 91-79-6636279 91-79-6641708 email:mailto:gujarat@bluelogics.comWWW: http://www.bluelogics.com/


* Trident Techlabs Pvt Ltd. offers a two courses in VLSI Design of duration 20 & 8 weeks respectively.


Trident Techlabs Pvt. Ltd. -- 169, 3rd Floor, -- Raja Garden, -- New Delhi-110 015 -- India -- Tel. : 91 -11- 591 7645, 591 7832 -- Fax : 91- 11- 593 9960


* http://www.tridenttechlabs.com/contactus.htm


* Benns Technologies Offers a 4 months Part time/Full Time course in VLSI at Bangalore


* Calorex Institute of Technology offers a VLSI ASIC CHIP DESIGN COURSE of 18 week duration.


* Vedant (launched by Semiconductor Complex Ltd an enterprise of Ministry of Information technology, govt. of India) offers a six month full time course and covers both front end and back end design including Analog & Mixed Signal design. The admission is through an entrance test


*VEDA IIT, -- D.NO. 7 -148/3 -- NEW NAGENDRA NAGAR COLONY, -- HABSIGUDA -- HYDERABAD -7 -- http://www.stph.net/vedaiit/


*TTM at Hyderabad, Bangalore offers IC Design courses specialized in BACKEND but fee is very high (90 thousand for backend )


TTM (INDIA) PVT, LTD. -- B-1/2, Chandralok Cplx, -- 111, S.D. Rd, -- Secunderabad - 3 -- Ph: 040-7844198 -- Email ::mailto:mmpraju@hd1.vsnl.net.in